Zyphora
Zyphora
As AI workloads and high-performance computing (HPC) clusters scale, server TDP (Thermal Design Power) has broken historic limits. Air cooling alone can no longer sustain modern AI architectures efficiently. We address this technical boundary through custom OEM/ODM server cooling systems engineered to keep systems stable, reliable, and energy-efficient.
By leveraging liquid-to-air and direct-to-chip (D2C) liquid cooling loops, data centers can significantly reduce chiller usage, dropping Power Usage Effectiveness (PUE) to industry-leading levels.
Next-generation AI GPU computing racks generate dense heat profiles that traditional heat sinks fail to manage. Our custom cold plates dissipate thermal loads exceeding 1000W per processor.
Engineered with quick-disconnect couplings, secondary containment layers, and smart EPDM/stainless steel fluid conduits to prevent damage to sensitive rack components.
| Thermal Technology | Maximum TDP Supported | Typical PUE Range | Ideal Server Deployment Scenarios | Relative CAPEX / OPEX |
|---|---|---|---|---|
| Enhanced Air & Vapor Chambers | Up to 350W / Node | 1.35 - 1.50 | Standard Intel Xeon/AMD EPYC CPU nodes, 1U/2U Edge computing servers. | Low CAPEX / High OPEX (Fan power) |
| Direct-to-Chip (D2C) Cold Plate | 350W - 1200W+ / Node | 1.12 - 1.25 | Dense GPU Rack configurations, AI deep learning nodes, high-frequency storage clusters. | Moderate CAPEX / Low OPEX |
| Single-Phase Immersion Cooling | 1500W+ per System Area | 1.03 - 1.10 | Supercomputing centers, extreme climate locations, greenfield hyperscale datacenters. | High CAPEX / Lowest OPEX |
Rapid deployment of AI processing networks in regions like North America, Western Europe, and East Asia has forced local regulatory authorities to set stringent carbon footprint goals. The European Union's Energy Efficiency Directive (EED) and municipal PUE limitations in major tech hubs demand that enterprise operations re-evaluate cooling systems.
We work closely with global design engineers to deliver customized OEM/ODM components that meet regional environmental standards while maximizing rack density and reliability.
Our R&D team works closely with leading silicon manufacturers and system integrators to keep cooling systems ahead of GPU innovation cycles. Our engineering roadmap targets key paradigm-shifting developments:
Transitioning from single-phase fluids to phase-change refrigerants, taking advantage of latent heat of vaporization to cool components up to 1500W per node with zero pump power inside the micro-channel loops.
Integrating telemetry modules directly into Cooling Distribution Units (CDUs) to monitor dew point, fluid pressure, flow rate, and heat loads dynamically, balancing flow speeds with server workloads.
Designing standardized chassis chassis mounts that enable operators to hot-swap individual processor cold plates without shutting down adjacent blade nodes, slashing maintenance MTTR.
Founded in 2017, Zyphora is a professional manufacturer and global supplier of AI GPU servers, high-performance computing systems, and customized data center solutions. Headquartered in Shenzhen, China, the company operates a modern production facility covering 386 square meters and serves customers across North America, Europe, Southeast Asia, and the Middle East.
With annual export revenue exceeding USD 18 million, Zyphora has built a strong reputation in the AI computing infrastructure industry through continuous innovation, reliable product quality, and customer-focused service. Our team brings over 12 years of industry experience and 7 years of export expertise, enabling us to support clients worldwide with efficient project delivery and professional technical assistance.
Zyphora specializes in AI GPU servers, GPU workstations, rackmount servers, storage servers, and customized computing solutions for artificial intelligence, machine learning, cloud computing, and high-performance computing applications. Supported by a robust supply chain network of more than 1,200 qualified partners, we ensure stable sourcing, flexible production, and rapid delivery.
Quality is at the core of everything we do. Our products undergo comprehensive reliability testing, thermal performance evaluation, burn-in testing, and functional inspections throughout the manufacturing process. A dedicated quality control team of 42 professionals ensures that every product meets strict international standards before shipment.
Innovation drives our growth. Our R&D department consists of 86 experienced engineers specializing in server architecture, thermal management, hardware integration, and AI infrastructure optimization. Each year, we introduce more than 120 new products and upgraded solutions to meet the evolving demands of global customers.
Zyphora offers comprehensive OEM and ODM services, including hardware customization, chassis design, branding, firmware configuration, and system integration. Our flexible manufacturing capabilities enable us to provide tailored solutions for cloud service providers, AI startups, research institutions, system integrators, data center operators, and enterprise customers.
Guided by the principles of quality, innovation, and customer success, Zyphora is committed to delivering advanced AI computing infrastructure that empowers organizations to accelerate digital transformation and unlock the full potential of artificial intelligence.
